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 SI1913DH
New Product
Vishay Siliconix
Dual P-Channel 20-V (D-S) MOSFET
FEATURES PRODUCT SUMMARY
VDS (V) rDS(on) (W)
0.490 @ VGS = -4.5 V -20 0.750 @ VGS = -2.5 V 1.10 @ VGS = -1.8 V
ID (A)
-1.0 - 0.81 - 0.67
D TrenchFETr Power MOSFETS: 1.8-V Rated D Thermally Enhanced SC-70 Package
APPLICATIONS
D Load Switching D PA Switch D Level Switch
SOT-363 SC-70 (6-LEADS)
S1 1 6 D1
S1
S2
Marking Code YY DC XX G1 Lot Traceability and Date Code G2
G1
2
5
G2
D2
3
4
S2
Part # Code
Top View
D1
D2
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150_C)a _ Pulsed Drain Current Continuous Diode Current (Diode Conduction)a Maximum Power Dissipationa Operating Junction and Storage Temperature Range TA = 25_C TA = 85_C PD TJ, Tstg TA = 25_C ID TA = 85_C IDM IS -0.61 0.74 0.38 -55 to 150 - 0.72 -3 -0.48 0.57 0.30 W _C -0.63 A
Symbol
VDS VGS
5 secs
Steady State
-20 "8
Unit
V
- 1.0
-0.88
THERMAL RESISTANCE RATINGS
Parameter
t v 5 sec Maximum Junction-to-Ambienta Maximum Junction-to-Foot (Drain) Notes a. Surface Mounted on 1" x 1" FR4 Board. Document Number: 71965 S-21482--Rev. A, 26-Aug-02 www.vishay.com Steady State Steady State RthJA RthJF
Symbol
Typical
130 170 80
Maximum
170 220 100
Unit
_C/W C/W
1
SI1913DH
Vishay Siliconix
New Product
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter Static
Gate Threshold Voltage Gate-Body Leakage Zero Gate Voltage Drain Current On-State Drain Currenta VGS(th) IGSS IDSS ID(on) VDS = VGS, ID = -100 mA VDS = 0 V, VGS = "8 V VDS = -16 V, VGS = 0 V VDS = -16 V, VGS = 0 V, TJ = 85_C VDS = -5 V, VGS = -4.5 V VGS = -4.5 V, ID = -0.88 A Drain-Source On-State Resistancea rDS(on) VGS = -2.5 V, ID = -0.71 A VGS = -1.8 V, ID = -0.2 A Forward Transconductancea gfs VSD VDS = -10 V, ID = -0.88 A IS = -0.47 A, VGS = 0 V -2 0.400 0.610 0.850 1.5 -0.85 -1.2 0.490 0.750 1.10 S V W -0.45 1 "100 -1 -5 V nA mA m A
Symbol
Test Condition
Min
Typ
Max
Unit
Diode Forward Voltagea
Dynamicb
Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Reverse Recovery Time Qg Qgs Qgd td(on) tr td(off) tf trr IF = 0.47 A, di/dt = 100 A/ms VDD = -10 V, RL = 20 W ID ^ -0.5 A, VGEN = -4.5 V, RG = 6 W VDS = -10 V, VGS = -4.5 V, ID = -0.88 A 1.2 0.3 0.21 18 25 15 12 30 30 40 45 20 60 ns 1.8 nC
Notes a. Pulse test; pulse width v 300 ms, duty cycle v 2%. b. Guaranteed by design, not subject to production testing.
www.vishay.com
2
Document Number: 71965 S-21482--Rev. A, 26-Aug-02
SI1913DH
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
3.0 VGS = 5 thru 3 .5V 2.5 3V 2.5 TC = -55_C 25_C 2.0 3.0
Vishay Siliconix
Transfer Characteristics
I D - Drain Current (A)
2.0
1.5 2V 1.0 1.5 V 1V 0.0 0 1 2 3 4
I D - Drain Current (A)
2.5 V
1.5 125_C 1.0
0.5
0.5
0.0 0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
On-Resistance vs. Drain Current
1.6 VGS = 1.8 V C - Capacitance (pF) 1.2 120 160
Capacitance
r DS(on) - On-Resistance ( W )
Ciss
VGS = 2.5 V 0.8
80
VGS = 4.5 V 0.4
40
Coss
0.0 0.0
0 0.5 1.0 1.5 2.0 2.5 3.0 0
Crss 2 4 6 8 10 12
ID - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
Gate Charge
5 V GS - Gate-to-Source Voltage (V) VDS = 10 V ID = 0.9 A 1.6
On-Resistance vs. Junction Temperature
3
r DS(on) - On-Resistance (W) (Normalized)
4
1.4
VGS = 4.5 V ID = 0.88 A
1.2
2
1.0
1
0.8
0 0.0
0.3
0.6
0.9
1.2
1.5
0.6 -50
-25
0
25
50
75
100
125
150
Qg - Total Gate Charge (nC)
TJ - Junction Temperature (_C)
Document Number: 71965 S-21482--Rev. A, 26-Aug-02
www.vishay.com
3
SI1913DH
Vishay Siliconix
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Source-Drain Diode Forward Voltage
2 1.6
On-Resistance vs. Gate-to-Source Voltage
1 I S - Source Current (A)
r DS(on) - On-Resistance ( W )
TJ = 150_C
1.2
ID = 0.88 A 0.8
TJ = 25_C
0.4
0.1 0 0.2 0.4 0.6 0.8 1.0 1.2
0.0 0 1 2 3 4 5
VSD - Source-to-Drain Voltage (V)
VGS - Gate-to-Source Voltage (V)
Threshold Voltage
0.30 0.25 0.20 V GS(th) Variance (V) 0.15 0.10 0.05 -0.00 -0.05 -0.10 -0.15 -50 0 0.01 1 Power (W) 3 ID = 100 mA 5
Single Pulse Power, Junction-to-Ambient
4
2
-25
0
25
50
75
100
125
150
0.1
1 Time (sec)
10
100
600
TJ - Temperature (_C)
Safe Operating Area, Junction-to-Ambient
10 IDM Limited P(t) = 0.0001 rDS(on) Limited I D - Drain Current (A) 1 P(t) = 0.001 ID(on) Limited 0.1 TA = 25_C Single Pulse BVDSS Limited 0.01 0.1 1 10 100 P(t) = 0.01 P(t) = 0.1 P(t) = 1 P(t) = 10 dc
VDS - Drain-to-Source Voltage (V)
www.vishay.com
4
Document Number: 71965 S-21482--Rev. A, 26-Aug-02
SI1913DH
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5
Vishay Siliconix
0.2
Notes:
0.1 0.1 0.05
t1 t2 1. Duty Cycle, D = t1 t2 PDM
0.02 Single Pulse 0.01 10- 4 10- 3 10- 2 10- 1 1 Square Wave Pulse Duration (sec)
2. Per Unit Base = RthJA = 170_C/W 3. TJM - TA = PDMZthJA(t) 4. Surface Mounted
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Foot
2 1 Duty Cycle = 0.5
Normalized Effective Transient Thermal Impedance
0.2 0.1 0.1 0.05
0.02 Single Pulse 0.01 10- 4 10- 3 10- 2 10- 1 Square Wave Pulse Duration (sec) 1 10
Document Number: 71965 S-21482--Rev. A, 26-Aug-02
www.vishay.com
5


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